Methods of manufacturing printed circuit boards with stacked micro vias

ABSTRACT

A method of manufacturing at least a portion of a printed circuit board. The method includes: applying a lamination adhesive on a first plural-layer substrate that includes a plurality of circuit layers with at least one first metal pad on a first side of the first plural-layer substrate; applying a protective film on the lamination adhesive; forming at least one via into the lamination adhesive to expose the at least one metal pad on the first side of the first plural-layer substrate; filling at least one conductive paste into the at least one via formed in the lamination adhesive; removing the protective film to expose the lamination adhesive on the first plural-layer substrate; and attaching the first plural-layer substrate with a second plural-layer substrate that includes a plurality of circuit layers with at least one second metal pad on a second side of the second plural-layer substrate.

CROSS-REFERENCE TO RELATED APPLICATION(S)

The present application is a divisional application of U.S. patentapplication Ser. No. 12/938,265 filed on Nov. 2, 2010; which adivisional application of U.S. patent application Ser. No. 12/381,925filed on Mar. 17, 2009, now issued as U.S. Pat. No. 7,856,706; which isa continuation of U.S. patent application Ser. No. 11/706,473 filed onFeb. 14, 2007, now issued as U.S. Pat. No. 7,523,545; which claimspriority to and the benefit of U.S. Provisional Application No.60/793,370 filed on Apr. 16, 2006, the entire content of which isincorporated herein by reference.

FIELD OF THE INVENTION

The present invention relates generally to printed circuit boards andmethods of manufacturing the same, and more particularly, to printedcircuit boards having circuit layers laminated with stacked (orstaggered) micro via(s) and methods of manufacturing the same.

BACKGROUND

Most electronic systems include printed circuit boards with high densityelectronic interconnections. A printed circuit board may include one ormore circuit cores, substrates, or carriers. In one fabrication schemefor the printed circuit board having the one or more circuit carriers,electronic circuitries (e.g., pads, electronic interconnects, etc.) arefabricated onto opposite sides of an individual circuit carrier to forma pair of circuit layers. These circuit layer pairs of the circuit boardmay then be physically and electronically joined to form the printedcircuit board by fabricating an adhesive (or a prepreg or a bond ply),stacking the circuit layer pairs and the adhesives in a press, curingthe resulting circuit board structure, drilling or laser drillingthrough-holes, and then plating the through-holes with a copper materialto interconnect the circuit layer pairs. The curing process is used tocure the adhesives to provide for permanent physical bonding of thecircuit board structure. However, the adhesives generally shrinksignificantly during the curing process. The shrinkage combined with thelater through-hole drilling and plating processes can cause considerablestress into the overall structure, leading to damage or unreliableinterconnection or bonding between the circuit layers. Thus, there is aneed for material and associated processes which can compensate for thisshrinkage and can provide for stress-free and reliable electronicinterconnection between the circuit layer pairs.

In addition, the plating of the through-holes (or vias) with the coppermaterial requires an additional, expensive, and time consuming processsequence that is difficult to implement with a quick turnaround. Thus,there is a need to provide for a printed circuit board and a method ofmanufacturing the same that can be quickly and easily assembled and/orensure alignment of the interconnections (or through-holes or microvias) on the printed circuit board during the assembly process tothereby reduce assembly costs.

SUMMARY

Aspects of embodiments of the present invention are directed to aprinted circuit board with Z-axis interconnect(s) or micro via(s) thatcan eliminate a need for plating micro vias and/or eliminate a need forplanarizing plated bumps of a surface, that can be fabricated with oneor two lamination cycles, and/or that can have carrier-to-carrier (orsubstrate-to-substrate) attachments with conductive vias, each filledwith a conductive material (e.g., with a conductive paste) in theZ-axis.

In one exemplary embodiment of the present invention, a printed circuitboard includes a plurality of circuit layers. Each of the circuit layersof the printed circuit board is formed with one or more copper foilpads. A core material is interposed between one and a corresponding oneof the circuit layers. The core material includes one or more micro viaseach having a conductive paste filled therein. The conductive pasteselectrically interconnect the conductive copper foil pads throughout thecircuit layers.

In one exemplary embodiment of the present invention, a printed circuitboard includes a plurality of circuit layers. Each of the circuit layersof the printed circuit board is formed with one or more copper foilpads. A core material is interposed between one and a corresponding oneof the circuit layers, or a lamination adhesive is interposed betweenone and a corresponding one of the circuit layers. The core materialincludes one or more micro vias each having a conductive paste filledtherein, and the lamination adhesive includes one or more micro viaseach having a conductive paste filled therein. The micro vias of thelamination adhesive correspond with the respective micro vias of thecore material. The conductive pastes electrically interconnect theconductive copper foil pads throughout the circuit layers.

In one exemplary embodiment of the present invention, a printed circuitboard includes a plurality of circuit layers. Each of the circuit layersof the printed circuit board is formed with one or more copper foil padsor with one or more micro via plates. A core material or a laminationprepreg is interposed between one and a corresponding one of the circuitlayers. The core material is formed to have one or more extendedportions of the micro via plates extended therein. The laminationprepreg includes one or more micro vias each having a conductive pastefilled therein. Here, the conductive pastes and the extended portions ofthe micro via plates electrically interconnect the conductive copperfoil pads and the micro via plates throughout the circuit layers.

In one exemplary embodiment of the present invention, a printed circuitboard includes a plurality of circuit layers (e.g., eight circuitlayers). Here, the conductive paste electrically interconnects at leastone of a plurality of copper foil pads (e.g., three copper foil pads)located on a side of a four-layer substrate to at least one of aplurality of copper foil pads (e.g., three copper foil pads) located ona side of another four-layer substrate.

An embodiment of the present invention provides a method ofmanufacturing a printed circuit board having a plurality of circuitlayers with at least one z-axis interconnect using a single laminationcycle. The method includes attaching a plurality of one-metal layercarriers with each other after parallel processing each of the pluralityof one-metal layer carriers. Here, the parallel processing of at leastone of the plurality of one-metal layer carriers includes: imaging atleast one photo resist onto a substrate having at least one copper foilformed on at least one side of the substrate; etching off the at leastone copper foil from the substrate with exception of at least one partof the at least one copper foil covered by the at least one photoresist; stripping off the at least one photo resist to expose the atleast one part of the at least one copper foil to form at least onecopper foil pad for one of the plurality of circuit layers; applying alamination adhesive on the substrate; applying a protective film on thelamination adhesive; forming at least one micro via into the substrateto expose the at least one copper foil pad at a side of the substrateopposite to the at least one side of the substrate; filling at least oneconductive paste into the at least one micro via formed in thesubstrate; and removing the protective film to expose the laminationadhesive on the substrate for attachment.

In one embodiment of the above manufacturing method, the attaching ofthe plurality of one-metal layer carriers includes: aligning theplurality of one-metal layer carriers adjacent to each other; and curingthe lamination adhesive on the substrate of each the plurality ofone-metal layer carriers to laminate the plurality of one-metal layercarriers with each other. The laminated one-metal layer carriers mayinclude a first side on which the one of the plurality of circuit layersis disposed, and a second side opposite to the first side. In oneembodiment, the method of manufacturing the printed circuit boardfurther includes: disposing a second one of the plurality of circuitlayers on the second side of the laminated one-metal layer carriers tocomplete a formation of the printed circuit board. Here, a third one ofthe plurality of circuit layers may be disposed between the one of theplurality of circuit layers and the second one of the plurality ofcircuit layers.

one embodiment of the above manufacturing method, the plurality ofcircuit layers of the printed circuit board manufactured using thesingle lamination cycle includes at least five circuit layers.

In one embodiment of the above manufacturing method, the plurality ofcircuit layers of the printed circuit board manufactured using thesingle lamination cycle includes at least six circuit layers.

, polyethylene, high density polyethylene, polyethylene napthalate,pacothane, polymethylpentene, and combinations thereof. Here, thepolyester film may be Mylar.

In one embodiment of the above manufacturing method, the at least onemicro via is fowled by laser drilling.

In one embodiment of the above manufacturing method, the at least onemicro via is formed by mechanical drilling.

In one embodiment of the above manufacturing method, the at least onephoto resist is imaged by laser-direct-imaging.

In one embodiment of the above manufacturing method, the at least onephoto resist is imaged by photo imaging, silkscreen imaging, offsetimaging, and/or inkjet imaging.

In one embodiment of the above manufacturing method, the plurality ofcircuit layers of the printed circuit includes an odd number of circuitlayers.

In one embodiment of the above manufacturing method, the parallelprocessing of at least another one of the plurality of one-metal layercarriers includes: imaging at least one photo resist onto a metal platehaving at least one copper flash formed on at least one side of themetal plate to develop at least one cavity; plating copper into the atleast one cavity; stripping off the at least one photo resist to form atleast one copper foil pad for one of the plurality of circuit layers;applying prepreg on the at least one copper foil pad to laminate theprepreg with the metal plate; curing the prepreg laminated with themetal plate with the at least one copper foil pad and the at least onecopper flash therebetween; peeling the at least one copper foil pad andthe at least one copper flash with the cured prepreg from the metalplate; and etching off the at least one copper flash to expose the atleast one copper foil pad on the cured prepreg. Here, the parallelprocessing of the at least another one of the plurality of one-metallayer carriers may further include: forming at least one micro via intothe cured prepreg to expose the at least one copper foil pad at oppositesides of the cured prepreg; and filling at least one conductive pasteinto the at least one micro via formed in the cured prepreg.

An embodiment of the present invention provides a method ofmanufacturing a printed circuit board having a plurality of circuitlayers with at least one z-axis interconnect using a single laminationcycle. The method includes attaching a plurality of one-metal layercarriers with each other after parallel processing each of the pluralityof one-metal layer carriers. The parallel processing of at least one ofthe plurality of one-metal layer carriers includes: imaging at least onephoto resist onto a metal plate having at least one copper flash formedon at least one side of the metal plate to develop at least one cavity;plating copper into the at least one cavity; stripping off the at leastone photo resist to form at least one copper foil pad for one of theplurality of circuit layers; applying a first side of a prepreg on theat least one copper foil pad to laminate the prepreg with the metalplate; curing the prepreg laminated with the metal plate with the atleast one copper foil pad and the at least one copper flashtherebetween; peeling the at least one copper foil pad and the at leastone copper flash with the cured prepreg from the metal plate; etchingoff the at least one copper flash to expose the at least one copper foilpad on the cured prepreg; applying a lamination adhesive on the curedprepreg; applying a protective film on the lamination adhesive; formingat least one micro via into the cured prepreg to expose the at least onecopper foil pad at a second side of the cured prepreg opposite to thefirst side of the cured prepreg; filling at least one conductive pasteinto the at least one micro via formed in the cured prepreg; andremoving the protective film to expose the lamination adhesive on thecured prepreg for attachment.

An embodiment of the present invention provides a printed circuit boardincluding: a plurality of circuit layers, a plurality of substrates, aplurality of lamination adhesives, and a plurality of one-metal layercarriers. Each of the plurality of circuit layers has at least onecopper foil pad. Each of the plurality of substrates is interposedbetween one and a corresponding one of the plurality of circuit layersand includes at least one micro via having a conductive paste filledtherein to interconnect the at least one copper foil pad of the one andthe at least one copper foil pad of the corresponding one of theplurality of circuit layers. Each of the plurality of laminationadhesives is interposed between one and a corresponding one of theplurality of substrates. Each of the plurality of one-metal layercarriers includes one of the plurality of circuit layers, acorresponding one of the substrates, and a corresponding one of theplurality lamination adhesives. In addition, the plurality of circuitlayers are electrically coupled with each other through the at least onemicro via of each of the plurality of substrates, and the plurality ofone-metal layer carriers are aligned adjacent to each other, andlaminated with each other by curing the plurality of laminationadhesives using a single lamination cycle.

In one embodiment of the above printed circuit board, the plurality ofcircuit layers of the printed circuit includes at least four circuitlayers.

In one embodiment of the above printed circuit board, the plurality ofcircuit layers of the printed circuit includes at least five circuitlayers.

In one embodiment of the above printed circuit board, the plurality ofcircuit layers of the printed circuit includes at least six circuitlayers.

In one embodiment of the above printed circuit board, the plurality ofcircuit layers of the printed circuit includes at least seven circuitlayers.

In one embodiment of the above printed circuit board, the plurality ofcircuit layers of the printed circuit includes at least eight circuitlayers.

In one embodiment of the above printed circuit board, at least one ofthe plurality of substrates includes a core material selected from thegroup consisting of metal, ceramic, FR4, GPY, and combinations thereof.

In one embodiment of the above printed circuit board, the plurality ofcircuit layers of the printed circuit comprises an odd number of circuitlayers.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, together with the specification, illustrateexemplary embodiments of the present invention, and, together with thedescription, serve to explain the principles of the present invention.

FIGS. 1 a, 1 b, 1 c, 1 d, 1 e, 1 f, 1 g, 1 h, and 1 i show a method ofmanufacturing a printed circuit board using a single lamination cycle orprocess sequence with stacked (or staggered) micro vias according to afirst exemplary embodiment of the present invention.

FIG. 2 shows a cross-sectional view of an embodiment of a printedcircuit board manufactured by the method(s) shown in FIGS. 1 a, 1 b, 1c, 1 d, 1 e, 1 f, 1 g, 1 h, 1 i, and/or 9.

FIGS. 3 a, 3 b, 3 c, 3 d, 3 e, 3 f, 3 g, 3 h, 3 i, and 3 j show a methodof manufacturing a printed circuit board using two lamination cycle orprocess sequence with stacked (or staggered) micro vias according to asecond exemplary embodiment of the present invention.

FIG. 4 shows a cross-sectional view of an embodiment of a printedcircuit board manufactured by the method shown in FIGS. 3 a-1 j.

FIGS. 5 a, 5 b, 5 c, 5 d, 5 e, 5 f, 5 g, 5 h, 5 i, 5 j, and 5 k show amethod of manufacturing a printed circuit board using one to twolamination cycle or process sequence with stacked (or staggered) microvias according to a third exemplary embodiment of the present invention.

FIG. 6 shows a cross-sectional view of an embodiment of a printedcircuit board manufactured by the method shown in FIGS. 5 a-5(k).

FIGS. 7 a, 7 b, 7 c, and 7 d show a method of manufacturing a printedcircuit board using a lamination process sequence for four or morecircuit layers with stacked (or staggered) micro vias according to afourth exemplary embodiment of the present invention.

FIG. 8 shows a cross-sectional view of an embodiment of a printedcircuit board manufactured by the method shown in FIGS. 7 a-7 d.

FIG. 9 shows a method of manufacturing a printed circuit board using asingle lamination cycle or process sequence with stacked (or staggered)micro vias according to another exemplary embodiment of the presentinvention.

DETAILED DESCRIPTION

In the following detailed description, certain exemplary embodiments ofthe present invention are shown and described, by way of illustration.As those skilled in the art would recognize, the described exemplaryembodiments may be modified in various ways, all without departing fromthe spirit or scope of the present invention. Accordingly, the drawingsand description are to be regarded as illustrative in nature, ratherthan restrictive. There may be parts shown in the drawings, or parts notshown in the drawings, that are not discussed in the specification asthey are not essential to a complete understanding of the invention.Like reference numerals designate like elements.

First Exemplary Embodiment

A method of manufacturing a printed circuit board using a singlelamination cycle or process sequence with stacked (or staggered) microvias according to a first exemplary embodiment of the present inventionwill be described with reference to FIGS. 1 a, 1 b, 1 c, 1 d, 1 e, 1 f,1 g, 1 h, and 1 i.

As shown in FIG. 1 a, a two-sided core or substrate 10 is prepared (step1). The substrate 10 includes a copper foil 10 a formed on oppositesides of the substrate 10 and a core material 10 b made of metal,ceramic, or insulating material (e.g., FR4, LCP, Thermount, BT, GPY,such as Teflon, thermally conducting carbon (stablecor), halogen free,etc., wherein GPY is a laminate that does not fit in the FR4 category,such as polyimide, aziridine cured epoxy, bismalimide, and otherelectrical grades of laminate). The present invention, however, is notthereby limited. For example, in one embodiment of the presentinvention, a single sided core or substrate is used having a copper foil(e.g., a, single foil 10 a) formed on only one side of the substrate.

Also, in one embodiment and as shown in FIG. 1 a, the substrate 10 has athickness ranging from 0.003″ to 0.004″. However, the present inventionis not thereby limited.

In FIG. 1 b, one or more photo resists 20 are imaged onto the substrate10 (step 2). Here, two photo resists 20 are shown to belaser-direct-imaged (or printed) onto one side of the substrate 10(i.e., the bottom side). However, the present invention is not therebylimited. For example, the two photo resists can be imaged using anysuitable printing technique, such as photo, silkscreen, offset, inkjet,etc.

In FIG. 1 c, the copper foil 10 a is etched off from the substrate 10with exception of the parts of the copper foil 10 a covered by the twophoto resists 20, which are then stripped off to expose corresponding(or two) copper foil pads 11 (step 3). The present invention, however,is not thereby limited. For example, in another embodiment of thepresent invention and as shown in FIG. 9, one or more one-metal layercarriers (e.g., one or more single sided circuits) are formed bypreparing a metal plate (e.g., a stainless steel plate).

In more detail and referring to FIG. 9, a copper flash (about fivemicrons) is electrolytic flash plated onto one or more sides the metalplate. One or more photo resists are applied to the one or more flashsurfaces of the metal plate. The photo resists are then imaged (i.e.,negative imaged) to develop one or more cavities. Copper is then platedinto the cavities. The photo resists are then stripped off to form oneor more copper foil pads for one or more circuit layers. In addition,one or more prepregs are applied on the copper foil pads to laminate theprepregs with the metal plate, and then cured. The prepregs arelaminated and cured with the metal plate with the copper foil pads andthe copper flashes therebetween. The copper foil pads and the copperflashes with the cured prepregs are then peeled from the metal plate.The copper flashes are then etched off to expose the copper foil pads onthe cured prepregs.

Once the above described circuit layer including the copper foil pads(e.g., pads 11 or the circuit layer including the copper pads of FIG. 9)has been formed, a protective film (or Mylar sheet) 40 shown in FIG. 1 dis attached to the core material 10 b of the substrate 10 (or the curedprepreg of FIG. 9) with a lamination adhesive (or prepreg or uncuredprepreg) 30 interposed between the Mylar sheet 40 (step 4) and the corematerial 10 b. Here, in FIG. 1 d, the Mylar sheet 40 is shown to beattached to the side of the substrate 10 opposite to the side of thesubstrate 10 where the two copper foil pads 11 are located. Theprotective film of the present invention, however, is not limited toonly Mylar sheet, and can be made of any suitable material, such aspolyester, oriented polypropylene, polyvinylfluoride, polyethylene, highdensity polyethylene, polyethylene napthalate, pacothane,polymethylpentene, or combinations thereof.

In FIG. 1 e, micro vias 50 are formed in the substrate 10 (or the curedprepreg of FIG. 9) (step 5). Each of the micro vias 50 is formed bylaser drilling (and/or mechanical drilling) a hole having a diameterranging from 0.004″ to 0.010″ into the substrate 10 (or the curedprepreg of FIG. 9).

In FIG. 1 f, a conductive paste (or ink) 60 is then filled into each ofthe micro vias 50 formed in the substrate 10 (or the cured prepreg ofFIG. 9) (step 6), and in FIG. 1 g, the Mylar sheet 40 is then peeled offto form a one (1)-metal layer carrier 70 for lay-up and lamination asshown in FIGS. 1 h and 1 i (step 7).

That is, as shown in FIG. 1 h, a plurality of 1-metal layer carriers 70shown in FIG. 1 g are attached after parallel processing to make “N”number of circuit layers for a printed circuit board 80 (step 8). InFIG. 1 h, the printed circuit board 80 is shown to have eight (8)circuit layers L1, L2, L3, L4, L5, L6, L7, and L8; or an 8 layer printedcircuit board is shown.

Finally, as shown in FIG. 1 i, the 8 layer printed circuit board 80including the lamination adhesives 30 is cured to laminate the circuitlayers L1, L2, L3, L4, L5, L6, L7, and L8 with each other to form the 8layer printed circuit board 80 (step 9). In FIG. 1 i, only circuit layerLI needs to be printed and etched to complete (or finish) the printedcircuit board 80 and/or to form the copper foil pads 11.

FIG. 2 is a cross-sectional view showing an embodiment of a printedcircuit board 80 manufactured by the method(s) shown in FIGS. 1 a, 1 b,1 c, 1 d, 1 e, 1 f, 1 g, 1 h, 1 i, and/or 9. The same reference numbersare used in FIG. 2 to refer to the same or like parts shown in FIGS. 1a-1 i.

The printed circuit board 80 shown in FIG. 2 includes a plurality ofcircuit layers L1, L2, L3, L4, L5, L6, L7, and L8. Each of the circuitlayers L1, L2, L3, L4, L5, L6, L7, and L8 of the printed circuit board80 is formed with one or more copper foil pads 11. A core material 10 bhaving a thickness ranging, for example, from 0.0003″ to 0.004″, from0.002″ to 0.004″, or from 0.003″ to 0.004″, is interposed between oneand a corresponding one of the circuit layers L1, L2, L3, L4, L5, L6,L7, and L8 (e.g., between circuit layers L1 and L2). For example, in oneembodiment, the core material 10 b is formed of a glass reinforced (106)FR4 having a thickness that is 0.002″ or greater. In another embodiment,the core material 10 b is formed of a non-reinforced polyimide filmsystem having a thickness that is 0.0003″ or greater. The core material10 b includes one or more micro vias 50 each having a conductive paste60 filled therein. The conductive pastes 60 electrically interconnectthe conductive copper foil pads 11 throughout the circuit layers L1, L2,L3, L4, L5, L6, L7, and L8. As such, the printed circuit board 80manufactured by the method shown in FIGS. 1 a, 1 b, 1 c, 1 d, 1 e, 1 f,1 g, 1 h, 1 i, and/or 9 can be used to enable a quick turnaround forball grid array packages, high density electronic circuit boards, etc.For example, by eliminating the sequential lamination and multipleorbiting the sequence of processes for creating the conductors and layerto layer interconnect(s), several enhancements can occur, such as: (1)fewer process steps, as low as ¼ the number of steps of a conventionalprocess, and fewer steps equal fewer opportunities for scrap(s) and/ormistake(s); (2) lower costs from yield loss and/or higher quality offinished goods; (3) improved registration capability to allow for higherdensity product (e.g., smaller landing pads to meet similar annular ringrequirements); (4) improved plant capacity (e.g., by several hundredpercent for this type of product); (5) extension of stacked micro-viatechnology to much higher layer counts (e.g., all cores are made at thesame time, so they all shrink at the same time during lamination and canbe up to 44+ layers); and (6) odd layer counts (i.e., most multilayerboards have even layer counts now).

Secondary Exemplary Embodiment

A method of manufacturing a printed circuit board using two laminationcycle or process sequence with stacked (or staggered) micro viasaccording to a second exemplary embodiment of the present invention willbe described with reference to FIGS. 3 a, 3 b, 3 c, 3 d, 3 e, 3 f, 3 g,3 h, 3 i, and 3 j.

As shown in FIG. 3 a, a single sided core or substrate 100 is prepared(step 1). The substrate 100 includes a copper foil 100 a formed on oneside of the substrate 100 (e.g., on a bottom side of the substrate 100)and a core material 100 b made of metal, ceramic, or insulating material(e.g., FR4, Polyimide, LCP, Thermount, BT, GPY, such as Teflon,thermally conducting carbon (stablecor), halogen free, etc.). In oneembodiment and as shown in FIG. 3 a, the substrate 100 has a thicknessranging from 0.003″ to 0.004″.

In FIG. 3 b, a protective file (or Mylar sheet) 140 is attached to thecore material 100 b of the substrate 100 with a lamination adhesive (orprepreg) 130 interposed between the Mylar sheet 140 (step 2) and thecore material 101 b. Here, the Mylar sheet 40 is shown to be attached tothe side of the substrate 100 opposite to the side of the substrate 100where the copper foil 100 a is located, and has a thickness of 0.001″.The protective film of the present invention, however, is not limited toonly Mylar sheet, and can be made of any suitable material, such aspolyester, oriented polypropylene, polyvinylfluoride, polyethylene, highdensity polyethylene, polyethylene napthalate, pacothane,polymethylpentene, or combinations thereof.

In FIG. 3 c, micro vias 150 are formed in the substrate 100 (step 3).Each of the micro vias 150 is formed by laser drilling (or mechanicaldrilling) a hole having a diameter ranging from 0.004″ to 0.010″ intothe substrate 100.

In FIG. 3 d, a conductive paste (or ink) 160 is then filled into each ofthe micro vias 150 formed in the substrate 100 (step 4).

In FIG. 3 e, the Mylar sheet 140 is then peeled off and replaced by acopper foil 100 a′ (that may or may not be identical to the copper foil100 a) to end up with the adhesive 130 between the copper foil 100 a′and the core material 100 b (step 5). Here, the copper foil 100 a′ islaminated to the substrate 100 with the adhesive 130 by a curingprocess.

In FIG. 3 f, one or more photo resists 120 are imaged onto the oppositesides of the substrate 100 (step 6). Here, two photo resists 120 areshown to be laser-direct-imaged (or printed) either side of thesubstrate 100 (and a total of four photo resists 120 are shown).

In FIG. 3 g, the copper foil 100 a and the copper foil 100 a′ are etchedoff from the substrate 10 with exception of the parts of the copperfoils 10 a covered by the four photo resists 120, which are thenstripped off to expose corresponding (or four) copper foil pads 111, toform a two (2)-metal layer carrier 170 (step 7).

In FIG. 3 h, a protective film (or Mylar sheet) 140′ is attached to the2-metal layer carrier 170 with a lamination adhesive (or prepreg or bondply) 130′ interposed between the Mylar sheet 140′ and the 2-metal layercarrier 170, and micro vias 150′ are formed in the substrate 100 with aconductive paste (or ink) 160′ filled into each of the micro vias 150′(step 8). Here, the lamination adhesive has a thickness ranging from0.002″ to 0.003″, and each of the micro vias 150′ is formed by laserdrilling (or mechanical drilling) a hole having a diameter ranging from0.004″ to 0.010″ into the lamination adhesive 130′. The Mylar sheet 140′is then peeled off for lay-up and lamination as shown in FIGS. 3 i and 3j. The protective film of the present invention, however, is not limitedto only Mylar sheet, and can be made of any suitable material, such aspolyester, oriented polypropylene, polyvinylfluoride, polyethylene, highdensity polyethylene, polyethylene napthalate, pacothane,polymethylpentene, or combinations thereof.

That is, as shown in FIG. 3 i, a plurality of 2-metal layer carriers 170each having the lamination adhesive 130′ and a last (or top) 2-metallayer carrier 170 not formed with the lamination adhesive 130′ areattached after parallel processing to make “N” number of layers for aprinted circuit board 180 (step 9). In FIG. 3 i, the printed circuitboard 180 is shown to have eight (8) circuit layers L11, L12, L13, L14,L15, L16, L17, and L18; or an 8 layer printed circuit board is shown.

Finally, as shown in FIG. 3 j, the 8 layer printed circuit board 180including the lamination adhesives 130′ is cured to laminate the circuitlayers L11, L12, L13, L14, L15, L16, L17, and L18 with each other toform the 8 layer printed circuit board 180.

FIG. 4 is a cross-sectional view showing an embodiment of a printedcircuit board 180 manufactured by the method shown in FIGS. 3 a-3 j. Thesame reference numbers are used in FIG. 4 to refer to the same or likeparts shown in FIGS. 3 a-3 j.

The printed circuit board 180 shown in FIG. 4 includes a plurality ofcircuit layers L11, L12, L13, L14, L15, L16, L17, and L18. Each of thecircuit layers L11, L12, L13, L14, L15, L16, L17, and L18 of the printedcircuit board 180 is formed with one or more copper foil pads 111. Acore material 100 b having a thickness ranging from 0.003″ to 0.004″ isinterposed between one and a corresponding one of the circuit layersL11, L12, L13, L14, L15, L16, L17, and L18 (e.g., between the circuitlayers L11 and L12), or a lamination adhesive 130′ having a thicknessranging from 0.002″ to 0.003″ is interposed between one and acorresponding one of the circuit layers L11, L12, L13, L14, L15, L16,L17, and L18 (e.g., between the circuit layers L12 and L13). The corematerial 100 a includes one or more micro vias 150 each having aconductive paste 160 filled therein, and the lamination adhesive 130′includes one or more micro vias 150′ each having a conductive paste 160′filled therein.

The micro vias 150′ of the lamination adhesive 130′ correspond with therespective micro vias 150 of the core material 130 a. The conductivepastes 160 and 160′ electrically interconnect the conductive copper foilpads 111 throughout the circuit layers L11, L12, L13, L14, L15, L16,L17, and L18. As such, the printed circuit board 180 manufactured by themethod shown in FIGS. 3 a-3 j can be used to enable a quick turnaroundfor ball grid array packages and/or high density electronic circuitboards.

Third Exemplary Embodiment

A method of manufacturing a printed circuit board using one to twolamination process cycle or sequence with stacked (or staggered) microvias according to a third exemplary embodiment of the present inventionwill be described with reference to FIGS. 5 a, 5 b, 5 c, 5 d, 5 e, 5 f,5 g, 5 h, 5 i, 5 j, and 5(k).

As shown in FIG. 5 a, a two sided core or substrate is imaged (orprinted or masked) and etched to form a first copper padded carrier 200a having a thickness of 0.0025″ and including circuit layers L23 and L24on opposite sides of the first copper padded carrier 200 a. Here, copperfoil pads (e.g., two copper foil pads) 211 are formed on the circuitlayer L23, and a copper foil 210 a is formed on the circuit layer L24.Also, in FIG. 5 a, a protective film (or Mylar sheet) 240 is shown to beattached to the first copper padded carrier 200 a with a bond ply 230(e.g., 1080 HR) interposed between the Mylar sheet 240 and the twocopper foil pads 211 (step 1). The protective film of the presentinvention, however, is not limited to only Mylar sheet, and can be madeof any suitable material, such as polyester, oriented polypropylene,polyvinylfluoride, polyethylene, high density polyethylene, polyethylenenapthalate, pacothane, polymethylpentene, or combinations thereof.

In FIG. 5 b, micro vias 250 are formed in the bond ply 230 (step 2).Each of the micro vias 250 is formed by laser drilling (or mechanicaldrilling) a hole having a diameter ranging from 0.004″ to 0.010″ intothe bond ply 230.

In FIG. 5 c, a conductive paste (or ink) 260 is then filled into each ofthe micro vias 250 formed in the bond ply 230 (step 3).

In FIG. 5 d, the Mylar sheet 240 is then peeled off, and a second copperpadded carrier 200 b having a thickness of 0.0025″ and including circuitlayers L21 and L22 on opposite sides of the second copper padded carrier200 b is attached to the first copper padded carrier 200 a with the bondply 230 interposed therebetween to form a first four-layer substrate 270a having the circuit layers L21, L22, L23, and L24 (step 4). Here, thesecond copper padded carrier 200 b includes copper foil pads (e.g., twocopper foil pads) 211 formed on circuit layer L22, and a copper foil 210a is formed on circuit layer L21. The conductive pastes 260 in the microvias 250 electrically interconnect the conductive copper foil pads 211of the circuit layer L22 and the conductive copper foil pads 211 of thecircuit layer L23.

FIGS. 5 e-5 h show a method for manufacturing a second four-layersubstrate 270 b having the circuit layers L25, L26, L27, and L28. Thesecond four-layer substrate 270 b can be combined with the firstfour-layer substrate 270 a manufactured by the method shown in FIGS. 5a-5 d to form a final printed circuit board 280 shown in FIGS. 5 kand/or 6.

As shown in FIGS. 5 e-5 h, the second four-layer substrate 270 b havingthe circuit layers L25, L26, L27, and L28 is manufacture by steps 5, 6,7, and 8. These four steps 5, 6, 7, and 8 shown in FIGS. 5 e-5 h aresubstantially similar to the method for manufacturing the firstfour-layer substrate 270 a having the circuit layers L21, L22, L23, andL24 in steps 1, 2, 3, and 4 shown in FIGS. 5 a-5 d (and, as such, adetailed description for manufacturing the second four-layer substrate270 b will not be provided in more detail).

In FIG. 5 i, micro via plates 290 are formed with each of the firstfour-layer substrate 270 a and the second four-layer substrate 270 bthrough laser drilling (or mechanical drilling) and plating. Each of themicro via plates 290 includes an extended portion 290 a extending into acorresponding core material 210 b. Here, the extended portions 290 a ofthe micro via plates 290 of the circuit layer L21 are formed through thecore material 210 b between the circuit layers L21 and L22 such that themicro via plates 290 of the circuit layer L21 are electricallyinterconnected to the conductive copper foil pads 211 of the circuitlayer L22 by the extended portions 290 a. The extended potions 290 a ofthe micro via plates 290 of the circuit layer L24 are formed through thecore material 210 b between the circuit layers L24 and L23 such that themicro via plates 290 of the circuit layer L21 are electricallyinterconnected to the conductive copper foil pads 211 of the circuitlayer L23 by the extended portions 290 a. The extended portions 290 a ofthe micro via plates 290 of the circuit layer L25 are formed through thecore material 210 b between the circuit layers L25 and L26 such that themicro via plates 290 of the circuit layer L25 are electricallyinterconnected to the conductive copper foil pads 211 of the circuitlayer L26 by the extended portions 290 a. Finally, the extended portions290 a of the micro via plates 290 of the circuit layer L28 are formedthrough the core material 210 b between the circuit layers L28 and L27such that the micro via plates 290 of the circuit layer L28 areelectrically interconnected to the conductive copper foil pads 211 ofthe circuit layer L27 by the extended portions 290 a.

In FIG. 5 j, a protective film (or Mylar sheet) 240′ is shown to beattached to the second four-layer substrate 270 b with a prepreg 230′(e.g., 1×2113 or 1080 HR) interposed between the Mylar sheet 240′ andthe circuit layer L25 of the second four-layer substrate 270 b. Theprotective film of the present invention, however, is not limited toonly Mylar sheet, and can be made of any suitable material, such aspolyester, oriented polypropylene, polyvinylfluoride, polyethylene, highdensity polyethylene, polyethylene napthalate, pacothane,polymethylpentene, or combinations thereof. Here, micro vias 250′ areformed in the prepreg 230′, each of the micro vias 250′ are formed bylaser drilling (or mechanical drilling) a hole having a diameter rangingfrom 0.004″ to 0.010″ into the prepreg 230′, and a conductive paste (orink) 260′ is then filled into each of the micro vias 250′ formed in theprepreg 230′.

Finally, as shown in FIG. 5 k, the final printed circuit board (or an 8layer printed circuit board) 280 is formed by removing the Mylar sheet240′, placing the first four-layer substrate 270 a on the secondfour-layer substrate 270 b such that the prepreg 230′ is between thecircuit layer L25 of the second four-layer substrate 270 b and thecircuit layer L24 of the first four-layer substrate 270 a, and thencuring the first four-layer substrate 270 a with the second four-layersubstrate 270 b to form the final printed circuit board (or an 8 layerprinted circuit board) 280.

FIG. 6 is a cross-sectional view showing an embodiment of a printedcircuit board 280 manufactured by the method shown in FIGS. 5 a-5 k. Thesame reference numbers are used in FIG. 6 to refer to the same or likeparts shown in FIGS. 5 a-5 k.

The printed circuit board 280 shown in FIG. 6 includes a plurality ofcircuit layers L21, L22, L23, L24, L25, L26, L27, and L28. Each of thecircuit layers L22, L23, L26, and L27 of the printed circuit board 280is formed with one or more copper foil pads 211. Each of the circuitlayers L21, L24, L25, and L28 of the printed circuit board 280 is formedwith one or more micro via plates 290. A core material 210 b or alamination prepreg 230 or 230′ is interposed between one and acorresponding one of the circuit layers L21, L22, L23, L24, L25, L26,L27, and L28. The core material 210 b is formed to have one or moreextended portions 290 a of the micro via plates 290 extended therein.The lamination prepreg 230 or 230′ includes one or more micro vias 250each having a conductive paste 260 filled therein.

Here, the conductive pastes 260 and the extended portions 290 a of themicro via plates 290 electrically interconnect the conductive copperfoil pads 211 and the micro via plates 290 throughout the circuit layersL21, L22, L23, L24, L25, L26, L27, and L28.

Fourth Exemplary Embodiment

A method of manufacturing a printed circuit board using a laminationprocess sequence for four or more circuit layers with stacked (orstaggered) micro vias according to a fourth exemplary embodiment of thepresent invention will be described with reference to FIGS. 7 a, 7 b, 7c, and 7 d.

As shown in FIG. 7 a, a first four-layer substrate 370 is prepared. Thefirst four-layer substrate 370 includes three dielectric cores and/orprepregs stacked adjacent to one another to form at least four circuitlayers of carrier. Here, in FIG. 7 a, a protective film (or Mylar sheet)340 is shown to be attached to the first four-layer substrate 370 with alamination adhesive (or prepreg or bond ply) 330 interposed between theMylar sheet 340 and the first four-layer substrate 370. The protectivefilm of the present invention, however, is not limited to only Mylarsheet, and can be made of any suitable material, such as polyester,oriented polypropylene, polyvinylfluoride, polyethylene, high densitypolyethylene, polyethylene napthalate, pacothane, polymethylpentene, orcombinations thereof. A micro via 350 is formed in the laminationadhesive 330 and corresponds to at least one of a plurality of copperfoil pads (e.g., three copper foil pads) 311 located on a side of thefirst four-layer substrate 370. The micro via 350 is formed by laserdrilling (or mechanical drilling) a hole having a diameter ranging from0.004″ to 0.010″ into the lamination adhesive 330 (step 1). However, thepresent invention is not thereby limited.

In FIG. 7 b, a conductive paste (or ink) 360 is then filled into themicro via 350 formed in the lamination adhesive 330 (step 2).

Finally, as shown in FIGS. 7 c and 7 d, a final printed circuit board(or an 8 layer printed circuit board) 380 is formed by removing theMylar sheet 340 (step 3) for lay-up and lamination with a secondfour-layer substrate 370′. That is, the second four-layer substrate 370′is placed such that the lamination adhesive 330 is between the twosubstrates 370 and 370′ and then cured to form the final printed circuitboard 380. Here, the final printed circuit board 380 is formed such thatthe micro via 350 also corresponds to at least one of a plurality ofcopper foil pads (e.g., three copper foil pads) 311 located on a side ofthe second four-layer substrate 370′.

FIG. 8 is a cross-sectional view showing an embodiment of a printedcircuit board 380 manufactured by the method shown in FIGS. 7 a-7 d. Thesame reference numbers are used in FIG. 8 to refer to the same or likeparts shown in FIGS. 7 a-7 d.

The printed circuit board 380 shown in FIG. 8 includes a plurality ofcircuit layers (e.g., eight circuit layers). Here, the conductive paste360 electrically interconnects at least one of a plurality of copperfoil pads (e.g., three copper foil pads) 311 located on a side of afour-layer substrate 370 to at least one of a plurality copper foil pads(e.g., three copper foil pads) 311 located on a side of a secondfour-layer substrate 370′.

As such and in view of the above, a printed circuit board with Z-axisinterconnect(s) or micro via(s) is provided that can eliminate a needfor plating micro vias and/or eliminate a need for planarizing platedbumps of a surface, that can be fabricated with one or two laminationcycles, and/or that can have carrier-to-carrier (orsubstrate-to-substrate) attachments with conductive vias, each filledwith a conductive material (e.g., with a conductive paste) in theZ-axis.

While the invention has been described in connection with certainexemplary embodiments, it is to be understood by those skilled in theart that the invention is not limited to the disclosed embodiments, but,on the contrary, is intended to cover various modifications includedwithin the spirit and scope of the present invention, appended exhibit,and equivalents thereof. For example, one or more prepregs to the stackcan be used to supplement the adhesive films described above,particularly on the outer layer. In addition, circuits can be builtadditively on stainless steel carriers and laminated to prepregs to makethe single sided cores. This creates a very flat and precise geometryimpedance controllable circuit. The conductive ink for some layers canbe replaced with an inductive ink (e.g., containing ferrite) to allowbuilding R/C filters for EMF protection (in, e.g., automotive,aeronautics, etc.). Also, certain embodiments of the present inventioncan use resistive foils, or capacitive layers; can allow cavities withinthe board adjacent to conductors requiring high speed signals,transmission lines (air as a dielectric); can perform the same functionas is accomplished by backdrilling for higher speed applications such asservers; can use polyimide (or other film) bond ply instead of free filmadhesive; can use mixtures of films and composite materials to makerigid and/or flex constructions; and/or can pre-rout or punch individualcores to allow bendable interconnects without connectors.

What is claimed is:
 1. A method of manufacturing at least a portion of aprinted circuit board, the method comprising: attaching a plurality ofplural-layer substrates with each other after processing at least one ofthe plurality of plural-layer substrates, wherein each of the pluralityof plural-layer substrates comprising a plurality of circuit layers withat least one metal pad on a side of each of the plurality ofplural-layer substrates and the processing of the at least one of theplurality of plural-layer substrates comprises: applying a laminationadhesive on the at least one of the plurality of plural-layersubstrates; applying a protective film on the lamination adhesive;forming at least one via into the lamination adhesive to expose the atleast one metal pad on the side of the at least one of the plurality ofplural-layer substrates; filling at least one conductive paste into theat least one via formed in the lamination adhesive; and removing theprotective film to expose the lamination adhesive on the at least of theplurality of plural-layer substrates for attachment with the otherplurality of plural-layer substrates.
 2. The method of claim 1, whereinthe attaching of the plurality of plural-layer substrates comprises:aligning the plurality of plural-layer substrates to each other; andcuring the lamination adhesive on the at least one of the plurality ofplural-layer substrates to laminate the plurality of plural-layersubstrates with each other.
 3. The method of claim 1, wherein the atleast one of the plurality of plural-layer substrates comprises at leasttwo circuit layers.
 4. The method of claim 1, wherein the at least oneof the plurality of plural-layer substrates comprises at least threecircuit layers.
 5. The method of claim 1, wherein the at least one ofthe plurality of plural-layer substrates comprises at least four circuitlayers.
 6. The method of claim 1, wherein each of the plurality ofplural-layer substrates comprises a core material selected from thegroup consisting of metal materials, ceramic materials, organicmaterials, carbon materials, glass materials, and combinations thereof.7. The method of claim 1, wherein the protective film comprises amaterial selected from the group consisting of polyester, orientedpolypropylene, polyvinylfluoride, polyethylene, high densitypolyethylene, polyethylene napthalate, pacothane, polymethylpentene, andcombinations thereof.
 8. The method of claim 7, wherein the protectivefilm is Mylar.
 9. The method of claim 1, wherein the at least one via isformed by laser drilling.
 10. The method of claim 1, wherein the atleast one via is formed by mechanical drilling.
 11. The method of claim1, further comprising: imaging at least one photo resist onto the atleast one of the plurality of plural-layer substrates having a metalfoil formed on the side of the at least one of the plurality of plurallayer substrates; etching off the metal foil from the at least one ofthe plurality of plural-layer substrates with exception of at least onepart of the metal foil covered by the at least one photo resist; andstripping off the at least one photo resist to expose the at least onepart of the metal foil to form the at least one metal pad on the side ofthe at least one of the plurality of plural-layer substrates.
 12. Themethod of claim 1, wherein the attached plurality of plural-layersubstrates has a first outermost side and a second outermost sideopposite the first outermost side and comprises a metal foil formed onat least one of the first outermost side or the second outermost side.13. The method of claim 12, further comprising: Imaging at least onephoto resist onto the metal foil; etching off the metal foil withexception of at least one part of the metal foil covered by the at leastone photo resist; and stripping off the at least one photo resist toexpose the at least one part of the metal foil to form at least anothermetal pad on the at least one of the first outermost side or the secondoutermost side.
 14. The method of claim 1, wherein the at least one viahas a diameter between about 0.004″ and about 0.010″.